ABLECOM大訊集團

PRODUCT

PRODUCT

Category

3.5" SBC Fanless Chassis

Features
  1. Support 3.5” SBC motherboard, up to 15W CPU-TDP
  2. High-performance thermal solution
  3. 60W/12V Power Adapter
  4. Supports Wall-mount bracket
  5. Multi-extended I/O Connectors

 

M/B Form Factor

  3.5” SBC (146 x 102mm/5.75”x4.02”)

 

 Dimension(W x D x H)

  196mm x 151mm x 44.34mm (7.72”x5.94”x1.75”)

 

 Color

  Silver, Black C

 

 Processor Support

  TDP<15W (depends on CPU Heatsink)

 

 Drive Bay

  N/A (support M.2 Module or SATA-DOM Type)

 

 Peripheral Bay

  -

 

 Backplane

  -

 

 Expansion Slot

  -

 

 System Cooling

  Customized Thermal Block Solution

 

 Front I/O

  Depends on Motherboard Specification

 

 Back I/O

  1 x DC Jack
  1 x DIO Port (via DB9 Type)
  4 x USB2.0/3.0 Ports
  4 x COM Ports
  2 x Audio Jacks (MIC/SPK)

 

 Side I/O

  -

 

 Button

  1 x Power Button

 

 LED

  1 x Power LED (Green)
  1 x HDD Activity LED (Amber)

 

 Grounding

  1 x Grounding Screw

 

 Power Supply

  60W/ 12V Power Supply

 

 Wall-mount kit

  Wall-mount Bracket

 

 Environment

 

 

 

  Operating Temperature: 0o ~ 40oC (32o ~ 104oF)

  Storage Temperature: -40o ~ 80oC (-40o ~ 176oF)

  Operating Humidity: 5% ~ 85% RH (non-condensing)

  Storage Humidity: 5% ~ 95% RH (non-condensing)